CyberOptics 3D Solder Paste Inspection SPI Inline SPI- SE500 Ultra


vintage:2017

line-outed at 30th july.

conditions good.

SE500ULTRA™ HIGH-SPEED 3D SPI DESCRIPTION:

World-Class Accuracy At Fastest Speed.

The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor.

An all-new, improved ultrafast sensor combined with a unique ‘all-in-one’ scan technique – that integrates fiducial, barcode and range scans into one, seamless scan sequence – makes the SE500ULTRA 30% faster at 210cm²/sec.

The optional Dual Illumination sensor further enhances repeatability and reproducibility even on the smallest paste deposits. For improved repeatability, you can choose from the MicroPad and Dual Illumination sensor options for accurately measuring pads as small as 100 microns (4mils).

  • All-new, Ultrafast sensor with calibration-free design
  • 30% faster with unique ‘all-in-one’ scan sequence
  • New, Intuitive Touch Screen Interface with World-class Usability
  • Improved Repeatability with Dual Illumination Sensor Option
  • Closed Loop Printer Feedback Ready
  • CyberPrint OPTIMIZER™ Ready
  • Mounter Feed Forward Ready
Board Size (Max.) 510 x 510 mm
Board Size (Min.) 50 x 50 mm
Inspection Speed @ 30µm Up to 210cm²/sec
Inspection Speed @ 15µm 80cm²/sec
Gage R&R <<10%, 6σ